Machine features

• Designed and manufacture by GSP

• Support for workpieces with 6", 8"and 12"wafers, all substrates, round or square shapes for mounting on pre-cut tape

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• Highly flexible in operating range by changing of various chuck tables and frame tables (option)

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• ESD and UV cover for multiple applications

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• Die Attach Film (DAF) heating function (option)

       

• Environmental-conscious design and high UPH at the same time

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• The SAM-C8/12P is our state-of-the -art mounter with intuitive control and fast booting due to GUI

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• The SAM-C8/12P offers fast processing time approx 15s per wafer

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